Soldering Tip: Shape BCM/CM


How to use Shape BCM/CM + Examples

BCM/CM vs BC/C

The Shape BCM/CM tip differs from Shape BC/C by the addition of a hollow to its cut face, providing high solder retention capability. It is used for drag soldering and correction of bridging.

The surface tension of solder in the hollow section enables bridging to be corrected and prevents bridging from occurring when drag soldering. 

Correcting Bridging

When the tip is placed onto the bridge, solder that was left in the hollow section pulls solder from the bridge, removing it.
Please use this shape if solder amount of the bridge is small.
*If solder amount of the bridge is large, Shape J, K and H are recommended. 

BCM CM Correcting Bridging 1. Clean the hollow section with a cleaning sponge, etc. A small amount of solder may be left in the hollow section to aid removal of bridge.

2. Put the tip on the bridge section and drag it slowly. 


Preventing Bridging in Drag Soldering

Since the pulling force due to surface tension of this type is stronger than that of Shape BC, solder is not left in unnecessary areas during drag soldering.

BCM CM Drag Soldering

Feed solder on a hollow section and drag the tip along slowly.

Applying flux to leads and land pads before soldering prevents solder bridge.