fully automatic visual alignment BGA rework station
This BGA repair station can be used as an automated desoldering machine and is suitable for automatic visual placement of various chip devices on large PCB boards (such as 5G communication boards), automatic welding, and automatic PCB soldering station. It can be combined with SAP/ERP for software linkup (optional), and for temperature curve sub-board with S/N as the retroactive condition.
Power Supply
AC 380V +/- 10% 50/60Hz
Power
22KW (max) Top Heater: 2KW Bottom Heater: 2KW IR Preheater: 16KW Other: 2KW
PCB Size
Max: 660 x 600 mm Min: 10 x 10 mm
BGA Chip Size
Max: 100 x 100 mm Min: 1 x 1 mm
IR Heater Size
640 x 520 mm
Motion Control
X / Y / Z
Temperature Sensor
8 Pcs
Control System
Industrial PC + Servo Motion Control System
Display System
24" SD Display
Alignment System
2 Million Pixel Vision Alignment
Vacuum Adsorption
Fully Automatic
Alignment Accuracy
+/- 0.025 mm
Temperature Control
K-type Thermocouple Closed-Loop, Independent Temperature Control for each Unit, with Accuracy up to +/- 1°C
