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Seamark R8650 Fully Automatic BGA Rework Station

Seamark R8650 Fully Automatic BGA Rework Station

fully automatic visual alignment BGA rework station

This BGA repair station can be used as an automated desoldering machine and is suitable for automatic visual placement of various chip devices on large PCB boards (such as 5G communication boards), automatic welding, and automatic PCB soldering station. It can be combined with SAP/ERP for software linkup (optional), and for temperature curve sub-board with S/N as the retroactive condition.

Features

Precise Visual Alignment

Two sets of high-definition industrial cameras are used, and the repeat placement accuracy reaches ± 0.01mm. The 5 million pixels high-definition industrial camera system is for accurate measurement and positioning of the chip. The automatic vision software system automatically corrects the angle, and the image is displayed in HD. High-definition CCD (5 million pixels) and high-definition CCD (1.3 million pixels) industrial cameras can accurately detect with telecentric lenses to avoid image distortion, eliminate measurement errors, achieve accurate alignment, and repeat alignment accuracy of ± 0.01mm.

ESD Ionizer

Equipped with ionizer, which effectively eliminates static electricity on the board and protects the product.

Precise Motion Platform

It uses an industrial PC and servo motion control system to accurately control the X/Y/Z four-axis gantry structure to operate fully automatically and independently, together with a grinding marble platform and a precision grinding screw. The visual accuracy can reach ± 0.01mm.

Multi-functional Control Feature

The self-developed software system achieves fast positioning and stable temperature curve (with curve analysis function), easy operation and setting, and can automatically generate record files to achieve traceability of historical parameters. The operation interface is simple and fast, and a professional operation interface (system parameter setting, working mode setting, heating parameter setting, data recording, etc.) is set for different product characteristics.

Three Independent Heat Zones

Three heat zones that can be independently programmed and controlled with convection hot air heating in the upper zone and the lower zone. The lower zone has a large area heating wire layout, suitable for the repair of larger BGA, and the infrared preheating zone uses the German imported mediumwave ceramic infrared heating Plate heating. Maximum area: 645 x 524mm.

Stable Temperature Control

High-definition K-type thermocouple with accuracy up to ± 1 °C, dynamic PID multi-loop closed control selective reflow soldering process. With intelligent temperature compensation, and automatic memory function.

Bottom Heating System

The bottom preheating uses heating plate imported from Germany, and the built-in temperature measuring probe is more accurate, which effectively solves the heating temperature control effect. The bottom moving temperature zone automatically moves with the head to improve the board rework efficiency.

Specification
Power Supply AC 380V +/- 10% 50/60Hz
Power 22KW (max)
Top Heater: 2KW
Bottom Heater: 2KW
IR Preheater: 16KW
Other: 2KW
PCB Size Max: 660 x 600 mm
Min: 10 x 10 mm
BGA Chip Size Max: 100 x 100 mm
Min: 1 x 1 mm
IR Heater Size 640 x 520 mm
Motion Control X / Y / Z
Temperature Sensor 8 Pcs
Control System Industrial PC + Servo Motion Control System
Display System 24" SD Display
Alignment System 2 Million Pixel Vision Alignment
Vacuum Adsorption Fully Automatic
Alignment Accuracy +/- 0.025 mm
Temperature Control K-type Thermocouple Closed-Loop, Independent Temperature Control for each Unit, with Accuracy up to +/- 1°C
Feeding Device Semi-Automatic
Positioning L Shape with Universal Fixture
Dimensions  1235 L x 1215 W x 1850 H mm
Weight 660kg
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