Cleaning After BGA Removal

Recommended Soldering Tips for Cleaning after BGA Removal

To clean up your board after removing multiple pins or lead wires, Hakko recommends using the Spatula Shaped (SMD) Soldering Tip.

It is important to apply flux before soldering to prevent icicles forming from the leftover solder on the board. 

Icicles formed, no flux used

Cleaning without flux

No icicles formed, flux used

Cleaning with flux

SMD Removal

  1. Apply flux 
  2. Place the spatula tip on the P.W.B on an angle
  3. Move the tip slowly across and lift up quickly when done

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