Recommended Tips for soldering QFP
Both drag soldering and point soldering are suitable for soldering Quad Flat Packages (QFP).
Drag Soldering
Multiple tip shapes are capable of performing drag soldering.
NOTE: Applying flux to the leads and land pads before soldering helps to prevent problems such as solder bridges.
In addition, the shape BCM/CM which has a hollow in its surface helps prevent bridging. The increased surface tension from the hollow of Shape BCM/CM means that solder is not left in unnecessary areas, reducing solder bridges.
Shape BCM/CM (more info)
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Feed solder on a hollow section and drag the tip along slowly. |
Shape BC/C (more info)
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Put the cut surface to the leads and drag the tip slowly while feeding solder. |
Shape B (more info)
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Put the tip end to the leads and drag the tip slowly while feeding solder. |
Shape D (more info)
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Put the tip end to the leads and drag the tip slowly downwards while feeding solder. Take note of when to feed solder to prevent excess solder. |
Shape H (more info)
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Put the pad section to the leads and drag the tip along slowly. |
Shape J (more info)
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Lay down the long end of the tip and drag the tip slowly. Note the timing to feed solder to prevent excess solder. |
Shape K (more info)
Place the point of the soldering tip to the leads while laying down the entire blade. Feed the solder and drag the tip downwards slowly.
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Pin Though Hole (PTH)
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Quad Flat Pack (QFP)
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Point Soldering
There are a few shapes that are suitable for point soldering, however, Shape D is recommended especially for quad flat package (QFP) components.
Shape BC/C (more info)
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1. Put the tip end to the board and the through-hole at one time to heat them. |
Shape B (more info)
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1. Put the tip end to the board and the through-hole at one time to heat them. |
Shape D (more info)
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Pin Through Hole (PTH) 1. Put the tip end to the board and the through-hole at one time to heat them. |
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Quad Flat Pack (QFP) 1. Put the tip end to the leads |