Soldering Quad Flat Packages (QFP)


Recommended Tips for soldering QFP

QFP on circuit board

Both drag soldering and point soldering are suitable for soldering Quad Flat Packages (QFP). 

Drag Soldering

Multiple tip shapes are capable of performing drag soldering.
NOTE:
 Applying flux to the leads and land pads before soldering helps to prevent problems such as solder bridges.

In addition, the shape BCM/CM which has a hollow in its surface helps prevent bridging. The increased surface tension from the hollow of Shape BCM/CM means that solder is not left in unnecessary areas, reducing solder bridges.

Shape BCM/CM (more info)

BCM CM Drag Soldering

Feed solder on a hollow section and drag the tip along slowly.

Shape BC/C (more info)

BC Drag Soldering

Put the cut surface to the leads and drag the tip slowly while feeding solder.

Shape B (more info)

B Drag Soldering

Put the tip end to the leads and drag the tip slowly while feeding solder.

Shape D (more info)

Shape D Drag Soldering

Put the tip end to the leads and drag the tip slowly downwards while feeding solder. Take note of when to feed solder to prevent excess solder. 

Shape H (more info)

Shape H Drag Soldering Put the pad section to the leads and drag the tip along slowly.

Shape J (more info)

Shape J Drag Soldering

Lay down the long end of the tip and drag the tip slowly. Note the timing to feed solder to prevent excess solder.

Shape K (more info)

Place the point of the soldering tip to the leads while laying down the entire blade. Feed the solder and drag the tip downwards slowly. 

Shape K Drag Soldering (PTH)

Pin Though Hole (PTH)
Lay the blade down with the face flush against the board to transfer sufficient heat. 

Shape K Drag Soldering (PTH)

Shape K Drag Soldering (QFP)

Quad Flat Pack (QFP)
Lay the blade down with the line portion flush against the leads. Ensure that the tip does not come in contact with the IC

Shape K Drag Soldering (QFP)

Point Soldering

There are a few shapes that are suitable for point soldering, however, Shape D is recommended especially for quad flat package (QFP) components. 

Shape BC/C (more info)

BC/C Point Soldering

1. Put the tip end to the board and the through-hole at one time to heat them.
2. Feed solder to form smooth fillet on the land pad.

Shape B (more info)

B Point Soldering

1. Put the tip end to the board and the through-hole at one time to heat them.
2. Feed solder to form smooth fillet on the land pad.

Shape D (more info)

Shape D Point Soldering

Pin Through Hole (PTH)

1. Put the tip end to the board and the through-hole at one time to heat them.
2. Feed solder to form smooth fillet on the land pad.

Shape D QFP Soldering

Quad Flat Pack (QFP)

1. Put the tip end to the leads
2. Feed solder and drag the tip slowly outwards