Recommended Soldering Tips for Micro-Soldering
The recommended tip size for micro-soldering is one that matches the width of the micro-component (A), or (A-0.1)mm, as shown in the image below. Tips that are slightly larger than "A" can be used if it does not come into contact with the adjacent components.
Once the size has been determined, the various applicable shapes below can be selected, depending on your preferences. However, there may be instances where problems occur, such as cracking on multiple ceramic capacitors due to the thermal stress of soldering and insufficient heating on multi-layer printed wiring boards (PWBs). To avoid such issues, use a Nitrogen (N2) gas soldering iron to pre-heat before soldering.
Shape BC/C (more info)
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Put the cut surface to the board. *Photo shows T13-BCF1 with an N2 system iron for pre-heating effect. NOTE: Some IC are specified by the manufacturer not to be touched on the electrode by tip end. |
Shape D (more info)
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Put the tip end to the board. *Soldering tip in the picture is T30-D06 with an N2 system iron for pre-heating effect. NOTE: Some IC are specified by the manufacturer not to be touched on the electrode by tip end. |
Shape I (more info)
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The very fine tip end makes it easy to solder tiny chips. |
Shape J (more info)
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Lay down the long end of the tip to the board. *Photo shows T30-J with an N2 system iron for pre-heating effect. NOTE: Some IC are specified by the manufacturer not to be touched on the electrode by tip end. |
Shape K (more info)
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Place the point of the soldering tip to the leads while laying down the entire blade. *Photo shows T30-KU with an N2 system iron for pre-heating effect. NOTE: Some IC are specified by the manufacturer not to be touched on the electrode by tip end. |
Shape S - Narrow Pitch Soldering (more info)
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Shape SB: Tip end size R0.2 The special shape of the fine tip end makes it easy to solder a tiny chip. |
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Shape S: Tip end size R0.5 |