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1978-DP Silicone-Free Heat Sink Compound (4oz)

1978-DP Silicone-Free Heat Sink Compound (4oz)

CLEARANCE

$39.70 SGD
$39.70 SGD
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CLEARANCE/DEMO DISCLAIMER:

  • Clearance/demo items are non-exchangeable and non-refundable. No cancellation or returns are accepted. 
  • Clearance/demo items are limited in type and quantity. Items are whilst stocks last. 
  • All clearance items are unused, but may have old manufacturing dates/old stock. It may also have some stains or have missing, yellowed, dirty or torn packaging. 
  • Demo items may have been used for display or demonstrative purposes. It may also have some scratches - see actual product pictures. 
  • Clearance/demo items are NOT covered under warranty.
  • Orders placed on clearance/demo items are deemed to have accepted the above conditions.

Techspray 1978-DP Silicone-Free Heat Sink Compound (4oz)

Silicone-Free Heat Sink Compound draws heat away when applied to a component.
Also known as thermal grease, thermal paste thermal compound, CPU grease, heat paste, heat sink paste, and thermal interface material.

In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical applications, it is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required.
 
Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects.
Features & Benefits
  • Thermal conductivity - 0.92 W/m-K
  • Functional temperature range -40°F to 392°F (-40°C to 200°C)
  • Non-ozone depleting
  • Avoid solder defects due to silicon contamination
  • Easy application
  • Will not separate
  • Will not harden and crack
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