Optimal for minimizing solder and flux splash
Solder feeding equipment with V-grooving function for superior cost performance
Minimize solder and flux splash
- As shown below, when solder is cut with a V-groove it enables the release of gas pressure generated by the flux, thereby suppressing splash. However, because the V-groove exposes the flux to outside air the solder cannot be stored for a long period of time.
- When using solder with the HAKKO 375, you can groove the solder that you require.
Specifications
| Name |
Specifications |
| 375-1 |
0.5mm |
| 375-2 |
0.6mm |
| 375-3 |
0.8mm |
| 375-4 |
1mm |
Model No. 375
Rating : DC 24 V 75 mA
Solder feed speed: 27mm/sec.
Usable solder diameter: Φ0.3, Φ0.5, Φ0.6, Φ0.8, Φ1.0mm
Dimensions: 78(W)×98(H)×56(D)mm
Weight: 0.59kg
AC Adapter
Output voltage: DC 24 V
