An intelligent infrared soldering station with real-time temperature monitoring, optical alignment system, rapid heating, and cooling
Features
Real-time Temperature Monitoring
Real-time temperature display with automatic curve analysis function.
Optical Alignment System
High-definition CCD (2m pixels) digital imaging, automatic optical zoom system, manual control and laser red-dot alignment.
Rapid heating and cooling
The IR preheating zone is heated by a medium wave ceramic infrared heating plate, a multi-functional movable PCB fixing bracket, and a BGA bottom support frame with laminar integrated cooling fan.
Specification
Power Supply
AC 220V +/- 10% 50/60Hz
Power
5.65KW (max) Top Heater: 1.45KW Bottom Heater: 1.2KW IR Preheater: 2.7KW Other: 0.3KW
PCB Size
Max: 412 x 370 mm Min: 6 x 6 mm
BGA Chip Size
Max: 60 x 60 mm Min: 2 x 2 mm
IR Heater Size
285 x 375 mm
Temperature Sensor
1
Operation Method
7" HD Touch Screen
Control System
Autonomous heating control system V2
Display System
15" SD Industrial Display (720P)
Alignment System
2 million pixel SD Digital Imaging System. Automatic Optical Zoom with Laser Red-Dot Indicator
Vacuum Adsorption
Automatic
Alignment Accuracy
+/- 0.02 mm
Temperature Control
K-type Thermocouple Closed-Loop Control with Accuracy up to +/- 3°C
