Fully automatic BGA tin removal and reballing capabilities
Compatible with various sizes and ball diameters (0.3 - 0.76mm). Overall equipment includes BGA repair related process functions such as loading/unloading, visual positioning, tin removal, glue removal, polishing, cleaning, printing flux, reballing, AOI detection, sorting, etc.
Power Supply
AC: 220V +/- 10% 50/60Hz 1⌀
Operation Mode
Full Automatic
Loading Method
Left In / Right Out
BGA Size
Max: 100 x 100 mm Min: 5 x 5 mm
Preheating Table Temperature
<200°C (adjustable)
Tin Removal Heating Capacity
<400°C (adjustable)
Tin Removal Residual Amount
<15%
Line Change Time
30min
Solder Ball Size
0.3 - 0.76 mm
Reballing Accuracy
Deviation < 1/3 Ball Diameter
Repeated Positioning Accuracy
+/- 0.01 m
UPH
> 10pc
Dimensions
4700 L x 1500 W x 1850 H mm W including display: 2100 H including lights: 2100
Audible and Visual Alarm with message prompt. The front acrylic door of the emergency stop button is equipped with magnetic protection. During equipment operation, opening the door will automatically stop the leakage protector and the equipment will be grounded reliably.
