Tune in with Hakko
Measuring Tip-To-Ground Resistance
Oxides and flux can cause tip-to-ground resistance to increase, which results in an increased leak voltage. Read to learn how to measure and reduce tip-to-ground resistance!
Measuring Tip-To-Ground Resistance
Oxides and flux can cause tip-to-ground resistance to increase, which results in an increased leak voltage. Read to learn how to measure and reduce tip-to-ground resistance!
Measuring Leak Voltage
Long term usage of soldering stations can cause voltage leaks as wear and tear occurs. Read on to learn how to measure and reduce leak voltage!
Measuring Leak Voltage
Long term usage of soldering stations can cause voltage leaks as wear and tear occurs. Read on to learn how to measure and reduce leak voltage!
Measuring Tip Temperature
Measuring the tip temperature daily or at the start of each soldering session can alert the user of any deviations from the set temperature. Read on to know why that's important!
Measuring Tip Temperature
Measuring the tip temperature daily or at the start of each soldering session can alert the user of any deviations from the set temperature. Read on to know why that's important!
Calibration Adjustment of Soldering Stations an...
When different tips are used during soldering, the change in tip shape and its respective thermal capacity causes the actual temperature to deviate from the preset temperature. Read on to...
Calibration Adjustment of Soldering Stations an...
When different tips are used during soldering, the change in tip shape and its respective thermal capacity causes the actual temperature to deviate from the preset temperature. Read on to...
Hakko Micro Soldering Irons
Surface Mount Technology (SMT) Surface Mount Technology (SMT) is a method where electrical components are mounted on the surface of the circuit board. As the demands for compact and lightweight...
Hakko Micro Soldering Irons
Surface Mount Technology (SMT) Surface Mount Technology (SMT) is a method where electrical components are mounted on the surface of the circuit board. As the demands for compact and lightweight...